4

Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC

Year:
2017
Language:
english
File:
PDF, 3.14 MB
english, 2017
12

Multivariate Nonnegative Quadratic Mappings

Year:
2004
Language:
english
File:
PDF, 237 KB
english, 2004
27

Anand constitutive model of lead-free solder joints in 3D IC device

Year:
2016
Language:
english
File:
PDF, 1.38 MB
english, 2016